A042401A TYPE‑C Female Socket 24PIN, Recessed 0.65, Rear Two‑Pin Through‑hole SMT, L=9.2, Ultra‑thin, Exposed Tongue with Locking Holes, CH=0.25, Three‑Mode

Ultra-Thin Sink Plate Installation & Soldering Process Specification: The PCB sink slot size, pad layout, and rear 2-pin through-hole aperture must be designed in strict accordance with the recommended PCB layout of the drawing. The sink depth must be accurately controlled at 0.65mm to ensure that the product is flush with the PCB surface without warping or offset after installation. During SMT mounting, it is necessary to ensure that the rear 2 through-hole pins are accurately aligned with the PCB holes, and the SMD pads are fully fitted with the pins to avoid mounting offset, pin bending, cold solder and false solder. The peak temperature of reflow soldering must be strictly controlled within 260℃±5℃, and the high temperature residence time shall not exceed 10 seconds to prevent the PA9T/LCP housing from thermal deformation, the stainless steel shell coating from oxidation, and the pin gold plating from damage, which will affect the dimensional accuracy and electrical performance of the ultra-thin structure.

Exposed Tongue with Lock Hole Structure Use Specification: The product adopts exposed tongue springless structure with lock hole. When plugging and unplugging, the Type-C plug must be axially aligned with the receptacle, and force must be applied evenly along the axial direction. Violent plugging, oblique plugging, shaking plugging, and lateral bending are strictly prohibited to prevent tongue bending deformation, lock hole structure damage, and internal contact offset, so as to avoid affecting the plugging feel, electrical contact performance and service life of the interface. It is forbidden to use non-standard, deformed, damaged plugs or plugs with foreign objects for plugging, to prevent tongue scratching and gold plating layer falling off of the contacts.

High Current Use Special Specification: The rated maximum current of this product is 5.0A. When using, it is necessary to strictly match the wire with the corresponding wire diameter and the current-carrying design of the PCB pad to ensure sufficient current-carrying capacity of the VBUS and GND high-current transmission paths, and overload use is strictly prohibited. When working with high current for a long time, a good heat dissipation design must be done to prevent the product from excessive temperature rise, which will lead to the decline of insulation performance, aging of plastic housing, pin desoldering and other problems.

PCB Layout & Ultra-Thin Equipment Adaptation Requirements: The PCB pad size, sink slot, and positioning holes must be designed in strict accordance with the product drawing, and sufficient operating space for plug insertion and extraction must be reserved to avoid physical interference between the product and surrounding components, ultra-thin equipment housing, and PCB board. It is recommended that the unmarked tolerance of PCB layout be controlled within ±0.05mm to ensure the mounting accuracy, welding firmness and production yield of the ultra-thin structure. The opening of the equipment housing must strictly match the insertion size of the Type-C plug and the ultra-thin outline dimension of the product, and the thickness design of the housing must match the 0.65mm sink plate structure to avoid interference and damage to the ultra-thin tongue of the interface during plugging and unplugging.

High-Precision Dimension Control & Assembly Specification: This product adopts ±0.02mm ultra-high precision tolerance design. During assembly, the assembly tolerance must be strictly controlled to avoid forced assembly leading to deformation of the ultra-thin structure of the product, tongue offset, and pin bending. Anti-static protection must be done during assembly to avoid electrostatic breakdown damage to the internal contacts and gold plating of the interface, which will affect the high-speed data transmission performance.

Tape & Reel Packaging & Automatic Feeding Specification: This product is packaged in tape and reel, 1500PCS per reel. The peeling angle of the carrier tape must be controlled within the range of 165°-180°. When feeding with a fully automatic mounter, the nozzle position and suction must be strictly controlled to avoid deformation of the ultra-thin structure of the product, pin offset, and tongue bending caused by excessive nozzle pressure. After the tape is opened, it is necessary to avoid pulling and bending the carrier tape to prevent abnormal peeling force, product falling off and pin damage, which will affect the feeding efficiency and mounting accuracy.

Storage & Environmental Use Specification: The product must be stored in a dry, dust-free environment without corrosive gas and strong ultraviolet radiation. The storage temperature is controlled at 5℃~35℃, and the relative humidity is ≤75%. Avoid long-term exposure to high temperature, high humidity, acid-base corrosion and salt spray environment to prevent aging of plastic housing, oxidation of metal coating, and elasticity attenuation of the ultra-thin tongue. The product should be used as soon as possible after opening, to avoid long-term exposed storage affecting the electrical contact performance and structural accuracy.

Transportation & Turnover Specification: During the transportation and production turnover of the product, the original packaging must be kept intact. Severe impact, extrusion and falling of the tape reel are prohibited to prevent carrier tape deformation, product falling off, pin bending deformation, ultra-thin tongue damage, and shell bump deformation. Anti-static protection must be done during turnover to avoid electrostatic breakdown damage to the internal contacts and coatings of the interface.