Glue Sealing Waterproof Structure is Core, Protect Glue Surface Throughout: The bottom black epoxy resin glue layer is the core barrier of IP67 waterproofing. Do not scratch, bump, pierce or squeeze the glue surface during transportation, storage, turnover and production; do not touch the glue area with sharp objects; install the custom dedicated gasket correctly during assembly, ensure the gasket is intact, undamaged and tightly fitted, and perform a 1m/30min waterproof test after assembly.
4-Pin DIP Soldering Must Be Precisely Aligned & Fully Soldered: PCB through-hole size, position and diameter must follow the drawing strictly. Ensure all 4 pins are inserted vertically into PCB holes without tilt or jamming; ensure all solder joints are full, no cold solder, no dry joint, no solder bridge; avoid long-time high temperature baking on the glue surface during soldering to prevent epoxy resin aging and cracking.
Wave Soldering Temperature Profile Must Be Strictly Controlled: Wave soldering preheating temperature 150℃~180℃, preheating time 60~90s; soldering peak temperature 260±5℃, soldering time strictly 5±0.5s; do not exceed 265℃ or soldering time over 10s to prevent LCP housing deformation, contact plating damage, epoxy resin cracking and product structure failure.
Plating Protection & Salt Spray Environment Customization: Avoid scratching the shell and contact plating to prevent metal corrosion; for seaside, chemical, high salt spray environments, specify higher plating thickness and salt spray grade when ordering (standard product is 24H neutral salt spray).
Proper Mating Operation, No Forced Operation: Align the TYPE-C male plug horizontally with the female connector, apply force evenly along the axial direction; no angled insertion, forced mating, shaking mating or side pulling; do not use non-standard, deformed, damaged or dirty male plugs.
Precautions for Extreme Temperature Use: The product works stably in -55℃~+80℃, but avoid sudden temperature changes (such as from -55℃ directly to +80℃) to prevent thermal stress leading to structure loosening, solder joint cracking and waterproof failure; regular performance testing is required for long-term use at extreme temperatures.
Storage & Handling Environment Requirements: Store in dry, dust-free, non-corrosive and non-ultraviolet environment, storage temperature 5℃~35℃, relative humidity ≤75%; avoid long-term exposure to high temperature, high humidity, acid-base corrosion and salt spray environment; do anti-static protection during turnover, operators must wear anti-static wrist straps, do not touch terminals and glue surface with bare hands.
Plating Specifications Customizable, Specify Requirements When Ordering: Terminal and shell plating thickness, salt spray grade and plating material can be customized according to customer requirements; clearly mark all customization requirements when ordering to avoid specification mismatch; standard products are produced according to document specifications.
PCB Layout & Equipment Housing Adaptation Requirements: PCB pad size, through-hole diameter and positioning hole position must follow the drawing strictly, reserve sufficient vertical installation space and plug mating space to avoid physical interference with surrounding components and equipment housing; equipment housing opening must match product dimensions and plug insertion size to prevent interface damage during mating.
First Article Inspection & FAI Dimension Control: First article inspection must be performed before mass production, focus on inspecting key dimensions marked "XX" and FAI dimension serial numbers; mass production can only start after first article inspection is qualified to ensure product dimension consistency and assembly accuracy.
